According to a report, assembly of next generation iPhone already started. Foxconn, the Chinese company assigned with the task to assemble iPhone, started to take shipments of components for the device last month. Foxconn is the same company assembled iPhone 3GS and the iPad. Key manufacturers of next generation iPhone components include TPK, Wintek and Chimei Innolux for the touch panels, TXC for the quartz components, Kinsus for PCB, Largan Precision and Genius Electronic for the camera modules and Taiflex Scientific for the Flexible copper-clad laminate. The report comes exactly a month before the official announcement of next generation iPhone. Apple is expected to announce the new device during the 2010 Worldwide Developers Conference. The event will be held June 7 through June 11 at San Francisco’s Moscone West. An earlier report suggested that next generation iPhone might be available in stores the very first day of the conference. iPhone’s announcement might be more complicated this year due to the misplaced/lost/stolen? next generation iPhone prototype saga.
Source: 9 to 5 Mac
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